Suitable for the manufacturing of the 3nm logic technology node
A process to enhance the energy efficiency in the data center
Computes the echoes’ location in a 3D space
Faster cycle times for capping process
Metal-free and non-curing
Operates on the pulsed Time-of-Flight principle
Innovative thermoplastic PEEK gear solutions rewarded
Flexible and highly durable
Integrated Safety Solution for Higher Machine Availability
Enables accurate measurement ingas explosion hazard areas
Performs visual inspection at any magnification level
Designed for small installation spaces and high torques
Supports 10 Gigabit data transmission
Accurate 3D printing with measurable dimensional accuracy of ± 0.2mm
Enhanced efficiency through additive manufacturing
Designed in a flexible process
Equipped with laser class 1 to detect extremely small parts
Enable cable management on desks
Can be installed or removed easily
Help connect sensors in series
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