MINMAX expects that the space savings offered by its high power-density MDW10/I10 series will generate huge interest from European designers who face board space constraints in application areas such as mobile telecoms infrastructure, industrial automation, transportation, and embedded computing equipment,’ said Achun Tsai, Global Sales Manager of MINMAX. ‘The encapsulated package and excellent thermal performance also mean that designers can be confident about the long-term reliability of these products, even in the most demanding industrial applications.’
The MDW10/I10 converters’ robust, encapsulated DIP16 package have an industry-standard footprint of 0.94” x 0.54”, and is just 0.31” high. It weighs 6.5g. The high efficiency of the modules’ power regulation technology and the outstanding thermal characteristics of the MINMAX package design mean that the converters can achieve very high power density while supporting operation at temperatures up to 88°C. System design engineers can use the MDW10/I10 series to cut both board footprint and weight typically by 50% when replacing a competing module that has an equivalent power rating.