Available for the company’s phoenix microme|x and nanome|x 180 kV high resolution X-ray inspection systems, the new x|act inspection software from GE´s Inspection Technologies business finds application in manual inspection of electronic components as well as fully automated, CAD-based, X-ray inspection of solder joints in electronic assemblies. It is available in three versions: x|act base, x|act operator and x|act pro. All versions offer easier operation than previous packages, allowing more reliable inspection. Simple macro recording permits intuitive programming of inspection tasks in terms of position and imaging parameters, with all display settings saved with a mouse click. Automatically created sample maps can be used for all PCBs of the same type anywhere in the system, even when rotated and flipped, and automatic image enhancement improves live images to ensure greater precision of defect detection. Additional software features included in the x|act operator upgrade package include the facility to introduce a live CAD data overlay, automated saving of results, images and X-ray sample maps and CAD- based programming. In addition to all the features of the first two versions, users who upgrade to x|act pro can enjoy CAD-based image processing and live overview of PCB solder pad information in the X-ray image for easy identification, as well as statistical review based on inspection results and 3D auto-referencing for optimized positioning accuracy to a few micrometers. The inspection results and pad IDs can be viewed in the live image as an overlay at any time and from any viewing angle. This enables quick and precise solder joint mapping even with manual inspection. To keep programming time to a minimum, x|act operator and x|act pro import the CAD data of the PCB and create a model, which facilitates navigation and also enables inspection strategies to be assigned to the individual components to be inspected. Within x|act pro inspection strategies with all the information required for automatic inspection are contained in the library for many common solder joint types. After the inspection strategies have been assigned, the views required and inspection program are generated automatically. With CAD-based programming, all the programming steps can be performed offline at a separate workstation, meaning that the inspection system is not blocked during programming. It also means that programs can be transferred to every x|act-capable phoenix|x-ray system. phoenix nanome|x and microme|x X-ray inspection systems feature an open 180 kV, 15 or 20 Watt nanofocus or microfocus X-ray tube with the company’s temperature stabilized DXR detector technology, which ensures live inspection images at 30 fps. 3D computed tomography (CT) scans of small electronic devices are also a possible option for advanced 3D failure analysis tasks.
Edited by: Teoman Tugsuz