Xilinx Expands into New Applications with Cost-Optimized UltraScale+ Portfolio for Ultra-Compact, High-Performance Edge Compute

Enhanced scalability with low power and cost in new form factors enable UltraScale+ devices for numerous growth market opportunities ranging from IoT to networking

  • Xilinx Expands into New Applications with Cost-Optimized UltraScale+ Portfolio for Ultra-Compact, High-Performance Edge Compute
    Xilinx Expands into New Applications with Cost-Optimized UltraScale+ Portfolio for Ultra-Compact, High-Performance Edge Compute
  • Xilinx Expands into New Applications with Cost-Optimized UltraScale+ Portfolio for Ultra-Compact, High-Performance Edge Compute
    Xilinx Expands into New Applications with Cost-Optimized UltraScale+ Portfolio for Ultra-Compact, High-Performance Edge Compute
  • Xilinx Expands into New Applications with Cost-Optimized UltraScale+ Portfolio for Ultra-Compact, High-Performance Edge Compute
    Xilinx Expands into New Applications with Cost-Optimized UltraScale+ Portfolio for Ultra-Compact, High-Performance Edge Compute

Xilinx has expanded its UltraScale+ portfolio for new markets and applications that require ultra-compact and intelligent edge solutions. With new form factors that are 70% smaller than traditional Xilinx chip-scale packaging, the new Artix and Zynq UltraScale+ families can now address a wider range of applications within the industrial, vision, healthcare, broadcast, consumer, automotive, and networking markets. 

Based on 16 nanometer technology, Artix and Zynq UltraScale+ are available in TSMC’s state-of-the-art InFO (Integrated Fan Out) packaging technology. Using InFO, the new cost-optimized members of the Artix and Zynq UltraScale + family meets the need for intelligent edge applications by delivering high-compute density, performance per-watt, and scalability in an ultra-compact package. 

Artix UltraScale+ FPGAs: Built for High I/O Bandwidth and DSP Compute

The new Artix UltraScale+ is built on its field-proven FPGA architecture and is ideal for a range of applications including machine vision with advanced sensor technology, high-speed networking, and ultra-compact “4K-ready” video broadcasting. Artix UltraScale+ delivers 16 gigabits per-second transceivers to support emerging and advanced protocols in networking, vision, and video, while also delivering the highest DSP compute in its class. 

Zynq UltraScale+ MPSoCs: Optimized for Power and Cost

Cost-optimized Zynq UltraScale+ MPSoCs include the new ZU1 device and production-proven ZU2, and ZU3, all available in InFO factor packaging. As part of the Multi-Processing SoC line from the Zynq UltraScale+ family, the new ZU1 is designed for connectivity at the edge and for industrial and healthcare IoT systems, including embedded vision cameras, AV-over-IP 4K and 8K-ready streaming, hand-held test equipment, as well as consumer and medical applications. ZU1 is built for miniaturized compute-intensive applications and powered by a heterogenous Arm-based multi-core processor subsystem, while also being able to scale to ZU2 and ZU3-based devices for greater compute. 

Artix and Zynq UltraScale+ are Scalable and Secure

With the Xilinx Artix and Zynq UltraScale+ portfolio now extended from the high-end to the low-end, extending platform scalability ensures customers can develop multiple solutions using the same Xilinx platform. This preserves design investments across the portfolio and speeds time-to-market. 

Security is a critical component in Xilinx designs, and both members of the cost-optimized Artix and Zynq UltraScale+ families include the same robust security features found across the UltraScale+ platform. Included are RSA-4096 authentication, AES-CGM decryption, DPA counter-measures, and Xilinx’s proprietary Security Monitor IP that adapts to security threats across the product lifecycle, meeting the security needs for both defense and commercial projects.

Graduated in political sciences and international relations in Paris, Anis joined the team in early 2019. Editor for IEN Europe and the new digital magazine AI IEN, he is a new tech enthusiast. Also passionate about sports, music, cultures and languages. 

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