Xilinx Expands into New Applications with Cost-Optimized UltraScale+ Portfolio for Ultra-Compact, High-Performance Edge Compute

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Enhanced scalability with low power and cost in new form factors enable UltraScale+ devices for numerous growth market opportunities ranging from IoT to networking

Industry 4.0

Xilinx Expands into New Applications with Cost-Optimized UltraScale+ Portfolio for Ultra-Compact, High-Performance Edge Compute
Xilinx Expands into New Applications with Cost-Optimized UltraScale+ Portfolio for Ultra-Compact, High-Performance Edge Compute
Xilinx Expands into New Applications with Cost-Optimized UltraScale+ Portfolio for Ultra-Compact, High-Performance Edge Compute
Xilinx Expands into New Applications with Cost-Optimized UltraScale+ Portfolio for Ultra-Compact, High-Performance Edge Compute
Xilinx Expands into New Applications with Cost-Optimized UltraScale+ Portfolio for Ultra-Compact, High-Performance Edge Compute
Xilinx Expands into New Applications with Cost-Optimized UltraScale+ Portfolio for Ultra-Compact, High-Performance Edge Compute

Xilinx has expanded its UltraScale+ portfolio for new markets and applications that require ultra-compact and intelligent edge solutions. With new form factors that are 70% smaller than traditional Xilinx chip-scale packaging, the new Artix and Zynq UltraScale+ families can now address a wider range of applications within the industrial, vision, healthcare, broadcast, consumer, automotive, and networking markets. 

Based on 16 nanometer technology, Artix and Zynq UltraScale+ are available in TSMC’s state-of-the-art InFO (Integrated Fan Out) packaging technology. Using InFO, the new cost-optimized members of the Artix and Zynq UltraScale + family meets the need for intelligent edge applications by delivering high-compute density, performance per-watt, and scalability in an ultra-compact package. 

Artix UltraScale+ FPGAs: Built for High I/O Bandwidth and DSP Compute

The new Artix UltraScale+ is built on its field-proven FPGA architecture and is ideal for a range of applications including machine vision with advanced sensor technology, high-speed networking, and ultra-compact “4K-ready” video broadcasting. Artix UltraScale+ delivers 16 gigabits per-second transceivers to support emerging and advanced protocols in networking, vision, and video, while also delivering the highest DSP compute in its class. 

Zynq UltraScale+ MPSoCs: Optimized for Power and Cost

Cost-optimized Zynq UltraScale+ MPSoCs include the new ZU1 device and production-proven ZU2, and ZU3, all available in InFO factor packaging. As part of the Multi-Processing SoC line from the Zynq UltraScale+ family, the new ZU1 is designed for connectivity at the edge and for industrial and healthcare IoT systems, including embedded vision cameras, AV-over-IP 4K and 8K-ready streaming, hand-held test equipment, as well as consumer and medical applications. ZU1 is built for miniaturized compute-intensive applications and powered by a heterogenous Arm-based multi-core processor subsystem, while also being able to scale to ZU2 and ZU3-based devices for greater compute. 

Artix and Zynq UltraScale+ are Scalable and Secure

With the Xilinx Artix and Zynq UltraScale+ portfolio now extended from the high-end to the low-end, extending platform scalability ensures customers can develop multiple solutions using the same Xilinx platform. This preserves design investments across the portfolio and speeds time-to-market. 

Security is a critical component in Xilinx designs, and both members of the cost-optimized Artix and Zynq UltraScale+ families include the same robust security features found across the UltraScale+ platform. Included are RSA-4096 authentication, AES-CGM decryption, DPA counter-measures, and Xilinx’s proprietary Security Monitor IP that adapts to security threats across the product lifecycle, meeting the security needs for both defense and commercial projects.

Posted on April 26, 2021 - (399 views)
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