Posted on August 16, 2011 - ( views)
Solutions for the dissipation of heat from high-grade electronic components which are optimised often require materials with maximum thermal conductivity. Especially in the case of transient thermal input and small thermal input surfaces, the effective cooling of electronic components requires that the component rapidly absorbs the heat produced and transmits it for instance to a heatsink. For such applications, Fischer Elektronik offers a special processing method which makes it possible to combine contact surfaces made from copper (l = 380 W/m*k) with the heatsink in a positive-fit manner. The material thickness, number, geometry and the position of copper surfaces are all customized to meet the customer's specifications. Milling is used to ensure a surface with outstanding quality in terms of flatness and roughness for mounting semiconductor components or as a support.
With selectable dimensions
Flow-optimised hollow rib geometry
With diverse pin numbers
With integrated circulating guide grooves
For circuit boards
For LED and standard circuit boards
For LED modules
Temperature range from -40°C +500°C
With a grid of 1.27 mm
IEN Europe November presents an extensive Preview on SPS IPC Drives 2013, the leading trade show on electric automation, taking place in late November in Nuremberg, Germany. In an exclusive Interview , a leading representative of the show organizer Mesago talks about the exhibition's success factors. Apart from a special on Sensors, Test & Measurement , the November issue also features the Power In Motion section, with the latest developments in motion technology. In our Cover Story , you'll learn about the advantages of hybrid automation cables. Enjoy the reading!
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