Posted on August 16, 2011 - ( views)
Solutions for the dissipation of heat from high-grade electronic components which are optimised often require materials with maximum thermal conductivity. Especially in the case of transient thermal input and small thermal input surfaces, the effective cooling of electronic components requires that the component rapidly absorbs the heat produced and transmits it for instance to a heatsink. For such applications, Fischer Elektronik offers a special processing method which makes it possible to combine contact surfaces made from copper (l = 380 W/m*k) with the heatsink in a positive-fit manner. The material thickness, number, geometry and the position of copper surfaces are all customized to meet the customer's specifications. Milling is used to ensure a surface with outstanding quality in terms of flatness and roughness for mounting semiconductor components or as a support.
For large amounts of heat losses
With selectable dimensions
Flow-optimised hollow rib geometry
With diverse pin numbers
With integrated circulating guide grooves
For circuit boards
For LED and standard circuit boards
For LED modules
With the April issue, we celebrate the 40th anniversary of IEN Europe. For that occasion we present numerous interesting articles and interviews on technologies that have been groundbreaking over the past decades. An interview with Nexans is on the Evolution of Cables . A technical article by the EMVA on Machine Vision emphasizes the milestones that have been important for the automation industry. A very recent and up-to-date topic, Industry 4.0, is discussed in an Interview with Wibu Systems, a company dedicated to the protection of know-how. IEN Europe April also features a retrospective on Low-voltage Switchgear by Eaton. To celebrate IEN’s 40th anniversary properly, we have a Reader Offer for you, where you can win a high-tech visual IR thermometer. So please celebrate with us and enjoy!
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