Posted on August 16, 2011 - ( views)
Solutions for the dissipation of heat from high-grade electronic components which are optimised often require materials with maximum thermal conductivity. Especially in the case of transient thermal input and small thermal input surfaces, the effective cooling of electronic components requires that the component rapidly absorbs the heat produced and transmits it for instance to a heatsink. For such applications, Fischer Elektronik offers a special processing method which makes it possible to combine contact surfaces made from copper (l = 380 W/m*k) with the heatsink in a positive-fit manner. The material thickness, number, geometry and the position of copper surfaces are all customized to meet the customer's specifications. Milling is used to ensure a surface with outstanding quality in terms of flatness and roughness for mounting semiconductor components or as a support.
For LED modules
Temperature range from -40°C +500°C
With a grid of 1.27 mm
Made from aluminium
With high thermal conductivity
1-row horizontal design
With an integrated heatsink
For SMD plug-in connectors
For horizontal and vertical circuit board receptacle
This year, the IEN Europe Award for the most innovative product of the past twelve months went to Schaeffler for an online condition monitoring system. In an exclusive Interview, IEN Europe talked with two representatives of the company about the system, the acceptance of condition monitoring in general and further developments in that area that were presented at Hannover Messe 2013. The June issue also features a Special on Control & Automation, including product news, a Statement on recent IT trends in that field, and a Cover Story about combinig the latest RFID with IO-Link technology.
This year, the IEN Europe Award for the most innovative product of the past twelve months went to Schaeffler for their FAG...
Schaeffler Technologies AG & Co. KG