Posted on August 16, 2011 - ( views)
Solutions for the dissipation of heat from high-grade electronic components which are optimised often require materials with maximum thermal conductivity. Especially in the case of transient thermal input and small thermal input surfaces, the effective cooling of electronic components requires that the component rapidly absorbs the heat produced and transmits it for instance to a heatsink. For such applications, Fischer Elektronik offers a special processing method which makes it possible to combine contact surfaces made from copper (l = 380 W/m*k) with the heatsink in a positive-fit manner. The material thickness, number, geometry and the position of copper surfaces are all customized to meet the customer's specifications. Milling is used to ensure a surface with outstanding quality in terms of flatness and roughness for mounting semiconductor components or as a support.
For 0.5 mm pin contacts
With integrated interior guide grooves
Individual design possibilities
For large amounts of heat losses
With selectable dimensions
Flow-optimised hollow rib geometry
With diverse pin numbers
With integrated circulating guide grooves
The last issue of IEN Europe before the summer break features a Special on Hydraulics & Pneumatics . Read a technical article on the effective Monitoring of Hose Assemblies , or get to know more about the Role of Valves in Industrial Automation . This month’s Cover Story is a case story on reducing the setup times of machinery by using automated actuators. In our Interview , a representative from the company Flir talks about the possibilities of thermography in industrial applications and recent advancements. As usual, we provide you with lots of add-on information, such as videos and data sheets.
Enjoy IEN Europe June/July and have a great summer.
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Flir Systems Belgium