ATE China 2011 Draws to Successful Close

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Three-Day Exposition of Electronics Assembly and Packaging Technologies

ATE China 2011 Draws to Successful Close
ATE China 2011 Draws to Successful Close

ATE China 2011, held at the Shenzhen Convention and Exhibition Center with NEPCON South China 2011, recently came to a close. The dual event covered an exhibition area of 37,500 sqm and attracted more than 500 local and international electronics manufacturers to showcase their new innovations. These exhibitors debuted new technologies and equipment to a record-high 26,374 visitors from the electronics manufacturing industry.
During the three-day event, a full range of new electronics assembly and packaging equipment was displayed. The exhibits comprised mainly automatic assembly systems, robots, machine vision products, transfer devices and assembly system materials, as well as test and measurement systems. Also covered were the electronics assembly and packaging processing solutions for consumer electronics, home appliances, computers, LED, communication equipment, automobile electronics and their related industries.

Posted on October 12, 2011 - (382 views)
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