Polytec PT EC101 is a two-component, silver filled, electrically conductive epoxy from intertronics for chip and substrate bonding. Applications include micro-electronics, hybrid circuits, optoelectronics, LED and photovoltaic applications on ITO, TCO, metals, glass, Si, ceramic and most plastics. It can be cured below 100°C and still have a volume resistivity of 1-2 x 10^-3 Ω-cm. The special chemistry of this epoxy also allows rapid cure cycles at higher temperatures. Because of its USP Class VI biocompatibility certification, it will have special interest to those manufacturing disposable medical devices. The epoxy features fast curing (60 minutes at 95°C to 40 seconds at 180°C), a pot life at room temperature of two days, pH value of 8.5 and high temperature stability in service (-55°C to +200°C continuous to +300°C intermittent). Many pack options are available, including pre-mixed and frozen, and expert dispensing support is provided by the engineers at Intertronics regarding syringes, screen print, jet-dispensing or fast and easy manual application, e.g. for circuit repairs.
Electrically Conductive Epoxy
For chip and substrate bonding
- by Intertronics
- August 24, 2012
- 418 views
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