OPC Foundation Welcomes Emerson to Its Board of Directors

  Enquiry / contact me

Emerson also joins the OPC Foundation Field Level Communications (FLC) initiative to drive a holistic approach to sensor and device level communications across process and factory automation industries

Automation, Industry 4.0

Peter Zornio, Chief Technology Officer for Emerson Automation Solutions
Peter Zornio, Chief Technology Officer for Emerson Automation Solutions

The OPC Foundation is proud to announce Emerson has joined its Board of Directors  and sincerely welcomes Peter Zornio, Chief Technology Officer for Emerson Automation Solutions, as Emerson’s representative on the Board of Directors. Emerson is one of the world’s largest automation suppliers, providing engineering services and automation technologies to process and discrete manufacturing industries.

Emerson has a long history with the OPC Foundation. As one of its founding members, Emerson played an important role in the development and adoption of the first OPC data connectivity standard and contributed to the development of OPC UA, today’s open data interoperability standard. Emerson supports OPC UA initiatives by participating in OPC Foundation working groups and by adopting OPC UA in a wide variety of its family of products.

A de facto standard for IT and OT integration

Peter Zornio says: “OPC technology is well established in the automation space as the de facto standard for application-level communications. It also provides integration between operations technology (OT) and the IT world, including cloud-based environments.  We look forward to growing that role, as well as working with the OPC FLC initiative on expanding OPC technology into real-time communications between control and field-connected devices.  OPC is the best candidate to have a single communication standard cover the entire scope of automation architecture from intelligent field devices to the cloud.”

Peter Lutz, Director FLC Initiative: “Currently, the OPC Foundation is extending use of OPC UA down to the level of sensors and devices on the shop floor via its Field Level Communications (FLC) initiative. The value that a major player like Emerson brings to this initiative is important from both technical and market messaging perspectives. First, OPC Foundation Working Groups benefit from extensive Emerson field level expertise. Second, with its strong support for ongoing OPC UA standard development for use in both process and discrete industries, Emerson helps send a clear message to the market: OPC UA plays an equally important role in both verticals.

Stefan Hoppe, President and Executive Director, OPC Foundation commented: “It is gratifying to welcome a company of Emerson’s stature to the OPC Foundation Board of Directors. Working together with Emerson and our other valued board members, the OPC Foundation is now better positioned to deliver on its directive to provide the world with the best single data connectivity and interoperability standard for use throughout the enterprise, regardless of the industry sector.” 
 

Posted on October 20, 2020 - (446 views)
Related articles
"We strive to continuously deliver an efficient IoT architecture, i.e. the one ensuring unicity and authenticity of device, integrity of the firmware installed on it, and confidentiality of data."
How to Survive and Thrive in the Digital Economy
Ethernet-APL in the Field for High-availability Safety Applications
Flexible Robots for Warehouse Logistics
TSN for Connected Industries of the Future
Open Call: H2020 DIGITbrain Project
New Series of Transducers for High Performance Gaging Probes
First Commission for Condition Monitoring Software in China
A Revolution of the Modern Data Center
Securing the Competitiveness of Industry
A Revolution of the Modern Data Center
Go IIoT in 30 minutes. 'UniCloud' is Unitronics’ Complete, No-Code, IIoT Cloud Platform for OEMs and Machine Builders
Automated 3D Scanning and Inspection of Transport Stands
Pneumatic Clamps for Robotics and Automation
2021 Selection Guides of AC/DC Power Supplies and DC/DC Converters
Capacitive Measurement System with Preamplifier
5-Megapixel 3D Snapshot Sensor
IP67 Ultra-robust HMI Devices
Industrial Embedded PC with AMD Processors
300A Modular Crimp Module
New Series of Transducers for High Performance Gaging Probes
Automated 3D Scanning and Inspection of Transport Stands
Ultrasonic Sensors with IO-Link Interface
Turning Data into Actionable Information is Vital to the Success of any Industry 4.0 Projects
Robot-supported Ultrasonic Defect Testing and Quality Control
Automation to Meet Increasingly High Customer Requirements
Simplified Centralised Management of Edge-based Infrastructure
AI Convention 2020 Replays: Tilkal
AI Convention 2020 Replays: Oracle
5-Megapixel 3D Snapshot Sensor