Sigpack and Paal will become Bosch Packaging Systems

  Enquire / contact me

Name change underlines company's strategic approach

Sigpack and Paal will become Bosch Packaging Systems
Sigpack and Paal will become Bosch Packaging Systems

Bosch Packaging Technology, a leading supplier of holistic packaging and process technology, is changing the company names of its subsidiaries Sigpack Systems AG and Paal Verpackungsmaschinen GmbH, effective February 1. Sigpack Systems AG, based in Beringen, Switzerland, will become Bosch Packaging Systems AG.
Paal Verpackungsmaschinen GmbH in Remshalden, Germany will become Bosch Packaging Systems GmbH.
The renaming highlights Bosch’s strategic approach to provide an even wider variety of solutions from one source. With technologies from feeding and distribution to wrapping, cartoning, handling and case packing, Bosch Packaging Systems offers a comprehensive portfolio for primary and secondary packaging.
“As Bosch Packaging Systems, both companies benefit even more from the globally renowned reputation of the Bosch brand,” explains Friedbert Klefenz, President of Bosch Packaging Technology. “The product brands Sigpack and Elematic will continue to exist under the strong Bosch umbrella. This unified market presence strengthens our position as a leading supplier of innovative, customized solutions.”

Posted on February 3, 2011 - (6971 views)
by
Related articles
Honeywell Demonstrates Security Threats of USB Devices
A Lab Oscilloscope for an Electric Superbike
US Healthcare Sector Votes for Cogeneration
Motion Solutions for Clean Energy Applications
Freeing up technicians to build an aircraft
Energy Efficiency & Renewable Energy: Harnessing the Power of the Consumer
A New Name for SPS IPC Drives in 2019
Link3D Presents its Technology to Boost Additive Manufacturing at Formnext 2018
Emerson will Modernize a Gas Processing Plant in Algeria
Intelliconnect at Electronica 2018
New JD Mini for Maximum Efficiency
Sensing Innovation in Process and Control
Connect Everything with e-Factory
System-based High Precision Linkages
Ultrasonic Flowmeter for Air
Reflowable Thermal Switch
Mobile, Multi-protocol Diagnostics Mercury
Microscope Optics for IR cameras
Level Switches RFS-9 and RFS-12
Digital Multimeter, Gas Soldering Iron and Carrying Case
Verigo Model PB3 Reusable Temperature Data Logger
Compact Power Modules
Modular Compact CPU Board
Absolute Modular Encoders
Connector for Data Transmission
Mass Flow Controller FMA-2600A Series
High-Performance Box PC
Compact True Color Sensor
A new performance class in inductive displacement measurements
Positioning System
Verigo Model PB3 Reusable Temperature Data Logger
Ultrasonic Flowmeter for Laboratory
Co-Creating the Industry of the Future
Ultra-Low Power Accelerometer for IoT
New JD Mini for Maximum Efficiency
Bonfiglioli BSR Synchronous Reluctance Motors
Reflowable Thermal Switch
Measuring the Position of Hydraulic and Telescopic Cylinders
AI Convention Europe Presents KAPTAIN
Ultrasonic Flowmeters for Compressed Air