Versarien has signed an exclusive global distribution deal with Mouser Electronics in relation to its next generation thermal management solutions.
Mouser will forthwith stock Versarien's LPH00xx series of low-profile metallic foam heatsinks. Targeted at passive cooling in space-constrained electronic systems, where PCBs are packed with a multitude of semiconductor components, these heatsinks are based on the game-changing VersarienCu™ micro-porous copper material. This maximizes the available surface area for heat dissipation through its homogenously dispersed interconnected pores, as well as exploiting the superior thermal conductivity properties of copper. As a consequence, for a given thermal management task, the heatsink's height can be reduced significantly in comparison to competing solutions.
"We are very pleased to be leveraging Mouser's exceptional expertise and expansive distribution network," states Neill Ricketts, CEO and Founder of Versarien. "By partnering with Mouser, we can reach an even broader range of customers, providing additional sales and support to extend what we offer through our own operations."
"Versarien's portfolio of heatsink solutions aligns well with our current line card and customer base," said Barry McConnell, Senior Vice President of Products at Mouser Electronics. "The VersarienCu metallic heatsinks can be used to cool virtually any IC component, and we're excited to be offering these and other innovative technologies from Versarien to our engineering community."