X-in-Board Technology

  Enquire / contact me

For Combining Technologies in Standard PCBs

Energy Efficiency, Electronics & Electricity

X-in-Board Technology
X-in-Board Technology

AT&S has various special processes, materials and technologies that are optimized for specific requirements like high-density wiring, enhanced thermal performance or high frequency (HF). Yet many customers’ designs often only require these high-performance but more expensive technologies in small areas of the PCB. So it makes sense to combine low-cost standard boards with the relevant higher-priced, high-end technologies – but only where they are needed. AT&S meets these requirements with its X-in-Board concept. X-in-Board enables a combination of different technologies and materials within any common PCB, such as a standard FR4 board or multi-layers with vias (connections between layers) and PTHs (plated through holes).

High performance

The principle is that the main board is combined with a high-performance inlay, e.g. to optimize heat dissipation, HF characteristics or wiring density. As a result, in applications such as servers or notebooks, elements with high-density wiring (multi-layer inlays) can be partially integrated directly into the overall structure, so the customer can reduce the overall PCB thickness

Posted on April 6, 2018 - (21570 views)
AT+S Austria Technologie und Systemtechnik GmbH
Fabriksgasse 13
8700 Leoben - Austria
+43-3842-2000
+43-3842-200216
View full company profile
Location
Related articles
How Advanced Precision Motors Empower the IoT and Industry 4.0
Yamaichi Electronics and TE Connectivity Team Up
Transducer Without Slip Rings
Ceramic Fuse for Single-Phase Applications
EMC/RFI Filters for Inverter and Power Drive Systems
Ergonomic Safety Handles
Industrial Wireless LAN Access Points
FMAC NEO: 3-Phase Mains Filter
Get your Free Ticket to Hannover Messe 2019
Chip Fuse for Highest Demands
Single Phase Filter
Heaters of H series
NS Series Safety Switches
EMC Filter FN 3287 and FN 3288
Innovative Systems Solutions
Reflowable Thermal Switch
Abu Dhabi International Petroleum Exhibition & Conference
Innovative Systems Solutions Made by LAPP
Reflowable Thermal Switch
Abu Dhabi International Petroleum Exhibition & Conference
Ceramic Fuse for Single-Phase Applications
EMC/RFI Filters for Inverter and Power Drive Systems
Industrial Wireless LAN Access Points
FMAC NEO: 3-Phase Mains Filter
Chip Fuse for Highest Demands
SUT-H: for Hgh Inrush Currents
FPBB RAIL - Compact DIN-Rail Filter
DG11: IEC Appliance Plug with Circuit Breaker
Single-Stage Filter
Drive for Marine Installations
Ergonomic Safety Handles
Cloud Kit for IoT Sensor Devices
Gasketed Plate Heat Exchangers
Reflowable Thermal Switch
On the Road to Energy Sustainability
Hexagon PPM and Ditio Established a Partnership to Foster Digital Transformation
Digitalization will be the Number 1 Trend at ADIPEC 2018
Alkaline Batteries
Safety Switches with RFID Technology
Hannover Messe Lays the Foundations for the Digital Transformation