The two part adhesive system called EP21AN features a dielectric strength of >400 volts/mil and a volume resistivity greater than 1,013ohm-cm. The adhesive has been formulated with a non-critical 1/1 mix ratio by weight or volume. It cures readily at ambient temperatures or more quickly at elevated temperatures. EP21AN features excellent adhesion to a wide range of substrates including metals, ceramics, glass and many plastics. Bonds exhibit outstanding dimensional stability and shrinkage upon cure is very low.