A two component, silver filled, electrically conductive epoxy adhesive, EP77M-F-1, has been developed by Master Bond for high performance bonding. The two part compound, with one-to-one mix ratio by weight or volume, has 10-3Ω-cm volume resistivity and will set up in 5-10 minutes at room temperature. Full cure usually takes 8-12 hours at room temperatures and electrical conductivity develops rapidly. Operating over 4°K to +125°C, the compound has high bond strength to similar and dissimilar substrates with bonds resistant to thermal cycling and chemicals including water, oil and most organic solvents.
Edited by: Teoman Tugsuz
