Formulated to cure at room temperature or more rapidly at elevated temperatures with a convenient one-to-one (1:1) mix ratio by weight or volume, Master Bond Polymer System Supreme 11AOHT is a two component epoxy resin system for high performance bonding and sealing. It features high thermal conductivity, excellent electrical insulation properties, high temperature resistance up to 204°C as well as superior bond strength. The epoxy is a paste that can be applied without sagging or dripping even on vertical surfaces. As a toughened system, it is well suited to applications involving thermal cycling. Its chemical resistance profile includes water, oil and most organic solvents. It has high adhesion to most metals, ceramics, glass and vulcanized rubbers as well as many plastics. The bond strength is high in both shear and peel modes. Both part A and B are colored off-white. The epoxy resin system is widely used in the electronic, electrical, computer, metalworking, appliance, automotive and chemical industries where high bond strength and superior heat transfer properties are required.