Epoxy System

low exothermic

  • Epoxy System
    Epoxy System

The EP30M3LV epoxy system is formulated by Master Bond to help avoid excess heat buildup and damage to thermally sensitive components during potting operations. Curing at room temperatures or more rapidly at elevated temperatures, in various cross section thicknesses. Volume resistivity of 2x1015 ohm cm at 25°C, a fl exural strength of 980 kg/cm2 and a tensile strength of >8,000 psi.