Flip-Chip Pressure Sensor Die SE105

  Enquiry / contact me

It can be used for gauge or absolute pressure measurement

Sensor Technology

Flip-Chip Pressure Sensor Die SE105
Flip-Chip Pressure Sensor Die SE105

BCM SENSOR has presented a newly developed flip-chip pressure sensor die for mass production. This flip-chip sensor die, model SE105, is based on piezoresistive working principle and is manufactured by 6" silicon micro-machining process.

Shown below are two cross section of the SE105 flip-chip sensor die, which can be used for gauge or absolute pressure measurement.

Thanks to the unique manufacturing process, the flip-chip is realized at the SE105 pressure sensor die, resulting in the following advantages comparing to the conventional-structure of pressure sensor dies:

  • Either corrosive or conductive pressure medium can have direct contact with sensor dies; 
  • Die bonding and wire bonding are simplified to one bonding process of flip-chip;
  • Improved resistance to harsh environment.

The SE105 flip-chip pressure sensor die features also an outstanding non-linearity of 0.15%fs and an excellent long-term stability of 0.1%fs/year.

Posted on July 10, 2015 - (1157 views)
BCM Sensor Technologies BVBA
Industriepark Z4, Brechtsebaan 2
2900 Schoten-Antwerpen - Belgium
View full company profile
Related articles
2 in 1 Mechanical Position Sensor
Color Sensor
Digital Transmitter
Smart Fitting
Shock Transportation Data Logger MSR175
Laser Triangulation Sensors optoNCDT 1420
Sensing Innovation in Process and Control
Mechanical Position Sensor MP600 Series
The Internet of Things Starts with a Sensor
Temperature Sensors
2 in 1 Mechanical Position Sensor
Color Sensor
Position Transducers
High Precision Mechanical Position Sensor
Belt Alignment Tools
High Precision Inclination Sensor
Absolute Encoder for Drive Technology
Confocal Sensor for OEM Applications
LMI Technologies Receives the Certification for Integration with Universal Robots
SIKO Presents the PositionLine at SPS IPC Drives 2018 with IEN Europe