Flip-Chip Pressure Sensor Die SE105

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It can be used for gauge or absolute pressure measurement

Sensor Technology

Flip-Chip Pressure Sensor Die SE105
Flip-Chip Pressure Sensor Die SE105

BCM SENSOR has presented a newly developed flip-chip pressure sensor die for mass production. This flip-chip sensor die, model SE105, is based on piezoresistive working principle and is manufactured by 6" silicon micro-machining process.

Shown below are two cross section of the SE105 flip-chip sensor die, which can be used for gauge or absolute pressure measurement.

Thanks to the unique manufacturing process, the flip-chip is realized at the SE105 pressure sensor die, resulting in the following advantages comparing to the conventional-structure of pressure sensor dies:

  • Either corrosive or conductive pressure medium can have direct contact with sensor dies; 
  • Die bonding and wire bonding are simplified to one bonding process of flip-chip;
  • Improved resistance to harsh environment.

The SE105 flip-chip pressure sensor die features also an outstanding non-linearity of 0.15%fs and an excellent long-term stability of 0.1%fs/year.

Posted on July 10, 2015 - (1106 views)
BCM Sensor Technologies BVBA
Industriepark Z4, Brechtsebaan 2
2900 Schoten-Antwerpen - Belgium
+32-3-6418038
+32-3-2384171
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