Formulated for electrical potting and encapsulation applications, Master Bond EP36AO combines high thermal conductivity with thermal stability. Serviceable over -62 to 260 °C, it features, once cured, a dielectric strength of 3,150V/mm, a volume resistivity of 2-3x1012 Ωcm, and a thermal conductivity of 1.30-1.44 W/(m K) at 25°C. The flexible, heat resistant epoxy has a coefficient of thermal expansion exceeding 75 in/in x 10-6/°C at 60°C and a tensile strength of >138 bar. It is a capable adhesive and coating that adheres well to both metallic and non-metallic substrates and it features long-term chemical resistance to an array of organic and inorganic chemicals. As a one component system, the epoxy does not require any mixing and offers the convenience of flexible cure schedules. A typical gel time is 30 min at 82 °C, with full cures attained in 2-2½ h at 149 °C. This can be shortened further at higher temperatures. The epoxy will retain its liquidity as long as the temperature does not exceed 82 °C. It is supplied as a solid and has a minimum shelf life of three months, which can be doubled in its original unopened container.