Room Temperature Curing Epoxy

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Features ultra low coefficient of thermal expansion

Industrial Equipment & Supplies

Room Temperature Curing Epoxy
Room Temperature Curing Epoxy

The epoxy EP42HT-2LTE by Master Bond can be applied for a variety of bonding, sealing, coating and select casting applications in the electronic, aerospace, optical and specialty OEM industries. This two component epoxy has a flowable paste consistency that enables precise alignment with minimal fixturing. It cures at room temperature or more quickly with the addition of heat.

This system is notable for having a low coefficient of thermal expansion of 9-12 x 10-6 in/in/°C. With a tensile lap shear strength of over 1,200 psi, it bonds well to a wide variety of similar and dissimilar substrates, including metals, composites, ceramics, glass and many plastics.

The epoxy features superior electrical insulation properties, chemical resistance and dimensional stability over the wide service temperature range of -60°F to +300°F. It also offers low linear (<0.01%) and volumetric (<0.1%) shrinkage upon curing, which is useful for potting and encapsulation applications.

Posted on February 25, 2015 - (1025 views)
by
Master Bond Inc.
154 Hobart Street
07601 Hackensack - USA
+1-201-3438983
+1-201-3432132
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Description

Master Bond Inc. is a leading manufacturer of high performance adhesives, sealants, coatings, potting and encapsulation compounds and impregnation resins. Our line of products consists of epoxies, polyurethanes, silicones, acrylics, polyamides and latex systems.

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