Structural Adhesive

Cures at Room Temperature

  • Structural Adhesive
    Structural Adhesive

Formulated for structural applications in extreme environments with temperatures from -62 to +218°C, Master Bond Supreme 33 toughened, two-component epoxy offers high structural bond strength to a wide variety of substrates including metals, glass, ceramics, wood, vulcanized rubbers and many plastics. It also resists chemicals including water, oil and many organic solvents. The adhesive has a mix ratio of 100 to 70 by weight or 1 to 1 by volume. It cures conveniently at room temperature in 48 to 72 h. For optimal performance, the suggested schedule is curing overnight at room temperature followed by 2 to 3 h at 66 to 93°C. This 100% reactive epoxy does not contain any solvents or diluents. It produces high performance bonds boasting shear strength over 17.2 MPa, tensile shear strength greater than 51.7 MPa and a T-peel strength exceeding 2.63 kN/m. With a volume resistivity of 1014 Ω-cm, a dielectric strength over 15.7 kV/mm, and a dielectric constant of 3.8 at 24°C, the adhesive is an electrical insulator that is widely used in the electronic, electrical, aerospace and OEM industries. It is also available in a non-drip version called Supreme 33ND.

 

Edited by: Teoman Tugsuz