The EP21AOLV thermal conductive adhesive from Master Bond is a two component, thermally conductive, electrically isolating epoxy adhesive with a 1 to 1 mix ratio by weight or volume. This compound adheres well to a variety substrates. It has a low coefficient of expansion, low shrinkage, superb dimensional stability, superior durability and chemical resistance. This adhesive is 100% reactive and does not contain any solvents or volatiles. It has a thermal conductivity of 10BTU/in/ft²/hr/°F and a dielectric strength of >400 volts/mil. Its volume resistivity is >10¹³ ohm cm.
Thermal Conductive Adhesive
has one to one mix ratio
- by Master Bond Inc.
- September 16, 2010
- 1535 views
Thermal Conductive Adhesive
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