Thermal Conductive Adhesive

has one to one mix ratio

  • Thermal Conductive Adhesive
    Thermal Conductive Adhesive

The EP21AOLV thermal conductive adhesive from Master Bond is a two component, thermally conductive, electrically isolating epoxy adhesive with a 1 to 1 mix ratio by weight or volume. This compound adheres well to a variety substrates. It has a low coefficient of expansion, low shrinkage, superb dimensional stability, superior durability and chemical resistance. This adhesive is 100% reactive and does not contain any solvents or volatiles. It has a thermal conductivity of 10BTU/in/ft²/hr/°F and a dielectric strength of >400 volts/mil.  Its volume resistivity is >10¹³ ohm cm.