With a thermal conductivity > 3.14 W/mK and serviceability from -51 to 204°C, Master Bond EP21ANHT thermally conductive epoxy system helps mitigate the issues associated with tightly packed components and miniaturized electronic circuits. The cured two component adhesive is also an electrical insulator, further expanding its usefulness. It has a convenient 1 to 1 mix ratio by weight or volume and offers room temperature and faster elevated temperature cures. The technical features include 18-20 x 10-6/ºC coefficient of thermal expansion, >15,7 kV/mm dielectric strength, and > 689 kPa tensile shear strength. The adhesive resists a wide range of chemicals and adheres well to a variety of substrates.
Edited by: Teoman Tugsuz
