Master Bond EP21AOLV-2Med is often selected for bonding, sealing, coating and encapsulation applications in the medical device industry due to its biocompatibility and cytotoxicity certifications. This two component epoxy system withstands a variety of sterilization methods, including EtO, radiation and many cold sterilants.
The product is thermally conductive and electrically isolating with a smooth consistency and good flow properties. It bonds well to metals, composites, glass, ceramics, plastics and many rubber materials. This dimensionally system offers a high tensile modulus of 450,000-500,000 psi, a compressive strength exceeding 18,000 psi and very low shrinkage upon curing. EP21AOLV-2Med's viscosity and low coefficient of thermal expansion enable it to be suitable for potting and encapsulation applications. It also resists many chemical including water, oils and fuels. This medical grade product is serviceable over the temperature range of -60°F to +250°F.