Master Bond EP30FLAO is a two component epoxy resin system for high performance potting, bonding, sealing and coating. It is versatile and can be used in a wide variety of cryogenic applications. This low viscosity epoxy with good flow characteristics makes it applicable as a thermally conductive potting compound. It is widely used in the electronic, electrical, computer, metalworking, appliance and chemical industries where electrical insulation, environmental protection and heat transfer is required. The system features a wide service temperature range of 4K to 121ºC. Its thermal conductivity is 9-10 BTU/in/ft²/hr/ºF. The viscosity of the mixed compound is 5,000 to 6,000 cps at 23,8ºC.
Edited by: Jürgen Wirtz
