Master Bond's EP21TDCHT-LO two part epoxy adhesive/sealant is specially formulated for demanding applications where factors like temperature cycling, high vibration, and mechanical shock are an issue. It withstands cryogenic temperatures and meets NASA low outgassing specifications. This versatile system is used for a wide variety of structural, electronic, aerospace, medical, and oil & chemical processing applications. The product has a mix ratio of 1:1 by weight or volume and is formulated to cure at room temperature or more rapidly at elevated temperatures. As a toughened system, it is particularly well suited for bonding dissimilar substrates, especially when they have differing coefficients of expansion.
Edited by: Jürgen Wirtz
