Master Bond EP42HT-2LTEcan be applied for a variety of bonding, sealing, coating and select casting applications in the electronic, aerospace, optical and specialty OEM industries. This two component epoxy has a flowable paste consistency that enables precise alignment with minimal fixturing. It cures at room temperature or more quickly with the addition of heat.
This system is notable for having a low coefficient of thermal expansion of 9-12 x 10-6 in/in/°C. With a tensile lap shear strength of over 1,200 psi, it bonds well to a wide variety of similar and dissimilar substrates, including metals, composites, ceramics, glass and many plastics. The epoxy features high electrical insulation properties, chemical resistance and dimensional stability over the wide service temperature range of -60°F to +300°F. It also offers low linear (<0.01%) and volumetric (<0.1%) shrinkage upon curing, which is useful for potting and encapsulation applications.