Ideal for potting and encapsulation applications, Master Bond EP21LV features a low viscosity and high electrical insulation properties. It is broadly used in the medical and food industries, as it conforms to USP Class VI and Title 21, U.S. Code of Federal Regulations, FDA Chapter 1, Section 175.105 requirements. Offering a 1 to 1 mix ratio by weight or volume, the epoxy cures at room temperature in 24 to 36 h or faster at elevated temperatures. The rigidity of the cure can be altered by adjusting the mix ratio. Serviceable over the wide range of -54 to +121?C, this epoxy features a long working life of 60 to 75 minutes for a 200 g mass. It bonds well to a variety of substrates including metals, glass, wood, rubbers, ceramics and many plastics. It resists thermal cycling as well as water, oils, fuels, bases, acids and salts. The two-component epoxy produces durable bonds with a tensile strength of 52.4 MPa , a shear strength over 20.0 MPa and an elongation of 4.8% at 24?C. It has a volume resistivity of 1015 ?-cm and a coefficient of thermal expansion of 53 in/in x 10-6/?C. In addition to its standard amber-clear color, EP21LV is available in a wide variety of alternative colors.