Heat Sinks for SiC, GaN or IGBT Power Modules

Mersen's IsoMAXX cold plates provide high cooling capacity and minimal pressure drop

  • by Mersen
  • July 15, 2021
  • 826 views
  • Heat Sinks for SiC, GaN or IGBT Power Modules
    Heat Sinks for SiC, GaN or IGBT Power Modules

Mersen, the global expert in electrical power and advanced materials for high-tech industries, introduces IsoMAXX cold plates for liquid cooling systems. Meeting the high demands of modern power electronics, IsoMAXX cold plates are vacuum brazed and designed for low pressure drop. With an average thermal resistance of 6 °C/kW. And at ~600 mbar, they guarantee a lower pressure drop compared to previous models.

Optimal temperature range and versatile integration for power electronics

IsoMAXX cold plates provide an optimal temperature range for power electronics, where all individual chips and modules on the cold plate remain at the same temperature. No minimum spacing is required between modules, allowing versatile integration no matter how many modules are needed for a particular application. This allows development engineers to design solutions with minimal space requirements and increased efficiency.