Solutions for the dissipation of heat from high-grade electronic components which are optimised often require materials with maximum thermal conductivity. Especially in the case of transient thermal input and small thermal input surfaces, the effective cooling of electronic components requires that the component rapidly absorbs the heat produced and transmits it for instance to a heatsink. For such applications, Fischer Elektronik offers a special processing method which makes it possible to combine contact surfaces made from copper (l = 380 W/m*k) with the heatsink in a positive-fit manner. The material thickness, number, geometry and the position of copper surfaces are all customized to meet the customer's specifications. Milling is used to ensure a surface with outstanding quality in terms of flatness and roughness for mounting semiconductor components or as a support.