Withstanding cryogenic conditions and severe thermal cycling, the EP37-3FLFpolymer system developed by Master Bond is suitable for demanding applications where highly flexible, impact resistant bonds are required. Optically clear, it has a low exotherm, resulting in a good potting, encapsulating and casting system, especially where wider cross section thicknesses are specified. The two component epoxy cures without stressing delicate electronic components. Serviceable over 4K to 121 °C, it cures at room temperature in 2 to 3 days or faster at elevated temperatures. This epoxy offers a non-critical 1 to 1 mix ratio by weight or volume, and a low mixed viscosity of 1,400 to 1,500 cps. Additionally, users can work with a 100 g mass of the adhesive at room temperature for up to 90 min. The polymer system has a bond shear strength > 13.8 MPa and a T-peel strength of 25 pli. It features an elongation of 180% and high electrical insulation properties with a volume resistivity of 1x1014 Ω-cm. The epoxy bonds well to a variety of substrates including metals, glass, ceramics, rubbers and many plastics and is widely used in the optical, electrical, electronic, computer and OEM industries.
Edited by: Teoman Tugsuz