Master Bond EP21TDCS-LO is an electrically conductive silver-filled epoxy that passes ASTM 595 for NASA low outgassing specifications. It is widely used for demanding applications in the electronic, electrical, computer, semiconductor, aerospace and optical industries. The adhesive cures at room temperature in 24-48 hours and in just 1-2 hrs at 200ºF, producing tough high strength bonds. It features a tensile shear strength of more than 1,800 psi, a T-peel of greater than 5 pli, and outstanding adhesion to similar and dissimilar substrates. The volume resistivity of the system is less than 10-3 ohm-cm. Serviceable over the exceptionally wide range of 4K to 275ºF, EP21TDCS-LO is suitable for cryogenic applications. It withstands thermal cycling and is resistant to chemicals, including water, oil and most organic solvents.