Master Bond. Die attach adhesives serve a critical role in semiconductor assembly and throughout the product lifecycle. Beyond their ability to form a tight bond between die and various substrates, these adhesives help minimize the impact of mechanical and thermal stress, enhancing long-term product reliability. Among available die attach materials, epoxy adhesives in particular offer a broad range of characteristics designed to meet the unique requirements of even the most specialized application. In the semiconductor industry, the continued trend toward greater functionality packed into smaller die translates into correspondingly greater challenges for efficient assembly and continued lifecycle reliability. During manufacturing, these tiny die must be reliably assembled into integrated circuit (IC) packages, die-on-board systems, or complex stacked die-on-die assemblies. In the field, these packages, systems and assemblies must remain resistant to mechanical and thermal conditions that can degrade performance and, ultimately, lead to product failure.