Die Attach Adhesives Impact Product Quality Well Beyond Manufacturing

  Enquire / contact me

Help minimize the impact of mechanical and thermal stress

Industrial Equipment & Supplies

Die Attach Adhesives Impact Product Quality Well Beyond Manufacturing
Die Attach Adhesives Impact Product Quality Well Beyond Manufacturing

Master Bond. Die attach adhesives serve a critical role in semiconductor assembly and throughout the product lifecycle. Beyond their ability to form a tight bond between die and various substrates, these adhesives help minimize the impact of mechanical and thermal stress, enhancing long-term product reliability. Among available die attach materials, epoxy adhesives in particular offer a broad range of characteristics designed to meet the unique requirements of even the most specialized application. In the semiconductor industry, the continued trend toward greater functionality packed into smaller die translates into correspondingly greater challenges for efficient assembly and continued lifecycle reliability. During manufacturing, these tiny die must be reliably assembled into integrated circuit (IC) packages, die-on-board systems, or complex stacked die-on-die assemblies. In the field, these packages, systems and assemblies must remain resistant to mechanical and thermal conditions that can degrade performance and, ultimately, lead to product failure.

Posted on March 30, 2017 - (48188 views)
Master Bond Inc.
154 Hobart Street.
07601 Hackensack - USA
+1-201-3438983
+1-201-3432132
View full company profile
Description

Master Bond Inc. is a leading manufacturer of high performance adhesives, sealants, coatings, potting and encapsulation compounds and impregnation resins. Our line of products consists of epoxies, polyurethanes, silicones, acrylics, polyamides and latex systems.

Location
More products from this supplier
Silicone Adhesives
Highly Flexible Epoxy
Liquid Epoxy Resin
Epoxies, Silicones & UV Cures
Acid Resistant Epoxy
Adhesives, Sealants & Coatings
Heat Curing Epoxy
Silicone Potting Compound
Adhesive Technology
Epoxy System
Related articles
HMC Connectors
Built-in Syringe Pump
DC Charging Controller
Microwave Up & Downconverter
The Defy of Corrosion-free Energy Supply System
When Machine Design and Aesthetics Come Together
''Europe is Just the Beginning of our Global Expansion Plans''
Online Bolt Configurator
Power Spring for Draw Wire Encoder Application
Servo-electric Gripping Module
Microwave Up & Downconverter
Elesa Standard Machine Elements Ready for Hannover Messe
Print a wide range of labels and signs
Oil-free Compressed Air Technology
Precision Measuring Centers With “Cycloid Measurement”
Transmission Elements ZCL and ZCR
Torque Limiter
Industrial inkjet printers
Buttons and switches
Breakthrough Plug & Use Connectivity Technology
Servo-electric Gripping Module
Elesa Standard Machine Elements Ready for Hannover Messe
Print a wide range of labels and signs
Enclosure System
Cleanroom Technology
Porous Aluminium Products
Easily Print Labels from your Smartphone!
Hoist Trolleys
Planetary Gearboxes
New JD Mini for Maximum Efficiency