In the design of heat dissipation concepts, it is of the utmost importance to analyse the bottlenecks along the thermal path as early as possible and to thermo-technically optimize them. Here, special attention must be given to the correct contacting of the electronic components to the heat sink through the use of the appropriate heat conducting material. With the WLPK Heat-conducting Paste Fischer Elektronik meets the requirements of the market for a heat-conducting paste with high thermal conductivity (l=10W/m*K). The ceramic-filled, silicon free heat-conducting paste consists of a synthetic polymer and enables quick as well as effective heat dissipation in a temperature range of -60°C to +150°C. The paste does not harden, dry out or melt under normal application conditions and, further more, is not subject to any special storage requirements. For ease of application, the Heat-conducting Paste series is filled into 3, 5 and 10ml plastic syringes as standard. Other package sizes and types can be supplied in accordance with specific customer specifications.