Aremco Bond 860 is a two-component, 100% solids, aluminum nitride filled, thermally conductive epoxy, that is ideal for bonding and small encapsulation applications to 400 ºF (204 ºC). The product exhibits good adhesion to a variety of high temperature plastics such as polyimides and composites, as well as ceramics, glass, and high expansion metals. It is mixed in a ratio of 1 part base resin to 1 part activator by weight and cures in 24 hours at room temperature or in 2 hours at 200 oF. After curing, it exhibits a thermal conductivity of 8.5 Btu-in/hr-ft2-°F and dielectric strength of 250 volts/mil. The tensile shear strength is 1,375 psi. This system also demonstrates good corrosion protection and thermal shock resistance. Typical applications for the epoxy include the bonding of heat sinks and fins used in heat exchangers and electrical/electronic assemblies.