Silver Epoxy

  Enquire / contact me

Electrically conductive

Industrial Equipment & Supplies

Silver Epoxy
Silver Epoxy

Aremco-Bond 556-HTHC is a two-part, electrically and thermally conductive, high temperature epoxy formulated using a high purity silver flake. This adhesive exhibits a low volume resistivity of less than 0.0001 ohm-cm at room temperature and a thermal conductivity of 2.2 W/m-ºK. The continuous operating temperature range is 390 ºF (200 ºC) and intermittent use temperature is 480 ºF (250 ºC). The tensile shear strength is 1,700 psi and Shore D hardness is 90. Viscosity range is 40,000 to 45,000 cP. The product mixes easily in a 100-to-2 resin-to-hardener ratio by weight. It cures in 2 hours at 200 ºF or in 1 hour at 250 ºF. It comes in standard 50-gram kits and can be specially packaged in divided bipacks or pre-mixed and frozen syringes upon request. Typical applications include microelectronic chip bonding, semiconductor die-attach, hybrid packaging, and other electrical and electronic components used in connectors, lighting and sensor components.

Posted on January 28, 2014 - (857 views)
Aremco Products Inc
707-B Executive Boulevard
10989 Valley Cottage - USA
View full company profile
Related articles
AC-DC Power Supplies
DIN-Plus Compression Springs Parts 2 and 1
Cleanroom Technology
Porous Aluminium Products
Configurators for Motors, Gearboxes and Drives
ITW Named a New President / General Manager of Buehler Worldwide
What is Equipment-as-a-Service?
Easily Print Labels from your Smartphone!
Turntable Bearings for Medical Applications
Custom Engineered Components
The Reel that Works as Hard as You
Wave Spring
Hannay Reels Delivers Every Time
3 Phase Book Style EMC Filter
Fan Filters FF Series
Technopolymer Transmission Elements
LED Indicators
Smalley's Spirolox Retaining Ring
New JD Mini for Maximum Efficiency
System-based High Precision Linkages
Cleanroom Technology
Porous Aluminium Products
Easily Print Labels from your Smartphone!
Hoist Trolleys
Planetary Gearboxes
New JD Mini for Maximum Efficiency
JDN Mini 24/07
Comprehensive Bonding Technologies
High Performing Column Level Indicators