Presto is adopting Cadence Allegro® X Package Designer Plus, Clarity™ 3D Solver, Sigrity™ XtractIM™ technology and Celsius™ Thermal Solver to design IC packaging solutions. Presto plans to provide Cadence with input on software features, functions and workflows specific to their end-customer and market needs.
“We are pleased to collaborate with Cadence, a leader in electronic design software, system-level analysis, hardware and IP,” declared Cédric Mayor, vice president global strategy and corporate development at Presto. “Our ability to leverage the Cadence packaging design and analysis workflow will help us broaden our design services for IC packaging customers needing tailored capabilities and specific requirements. In our efforts to date, we have already seen a 50 percent faster turnaround time due to a reduction in design iterations enabled by Cadence technologies.”
“Developing today’s complex semiconductor packages, such as heterogeneous SiPs with 3D chip stacks and high-speed data transfer packages, requires a high level of collaboration between IC designers and package engineers,” said KT Moore, vice president, product management in the Custom IC & PCB Group at Cadence. “With no two package designs being alike, collaborating with Presto allows us to capture insights on state-of-the-art package design trends as well as design team collaboration and workflow productivity.”
SiP and 3D packages tend to require many rotations to optimize BOM and design tolerances to enable full control of chip performance reproducibility. With the addition of the Cadence portfolio, Presto offers a comprehensive set of design and qualification tools to help customers achieve the most efficient design for manufacturing (DFM) process, strengthening its position in microelectronics.