Presto Engineering and Cadence Partner to Expand Semiconductor Package Design Solutions for Automotive and IoT Markets

  Enquiry / contact me

Presto exclusively takes on Cadence's system design and analysis portfolio for advanced IC packaging

Electronics & Electricity, Industry 4.0

Presto Engineering and Cadence Partner to Expand Semiconductor Package Design Solutions for Automotive and IoT Markets
Presto Engineering and Cadence Partner to Expand Semiconductor Package Design Solutions for Automotive and IoT Markets

Presto is adopting Cadence Allegro® X Package Designer Plus, Clarity™ 3D Solver, Sigrity™ XtractIM™ technology and Celsius™ Thermal Solver to design IC packaging solutions. Presto plans to provide Cadence with input on software features, functions and workflows specific to their end-customer and market needs.

We are pleased to collaborate with Cadence, a leader in electronic design software, system-level analysis, hardware and IP,” declared Cédric Mayor, vice president global strategy and corporate development at Presto. “Our ability to leverage the Cadence packaging design and analysis workflow will help us broaden our design services for IC packaging customers needing tailored capabilities and specific requirements. In our efforts to date, we have already seen a 50 percent faster turnaround time due to a reduction in design iterations enabled by Cadence technologies.

Collaboration expected to reduce design turnaround and speed time to market

Developing today’s complex semiconductor packages, such as heterogeneous SiPs with 3D chip stacks and high-speed data transfer packages, requires a high level of collaboration between IC designers and package engineers,” said KT Moore, vice president, product management in the Custom IC & PCB Group at Cadence. “With no two package designs being alike, collaborating with Presto allows us to capture insights on state-of-the-art package design trends as well as design team collaboration and workflow productivity.

SiP and 3D packages tend to require many rotations to optimize BOM and design tolerances to enable full control of chip performance reproducibility. With the addition of the Cadence portfolio, Presto offers a comprehensive set of design and qualification tools to help customers achieve the most efficient design for manufacturing (DFM) process, strengthening its position in microelectronics.

Posted on July 7, 2021 - (279 views)
Related articles
Carlsberg Announces Extension of Digital Manufacturing Solutions Across 28 Breweries
Non-contact Switch for Hygienic Switching
Weidmüller Group Expands its Portfolio with Acquisition of Emphatec Inc. Team and Assets
Predictive Maintenance of Rotating Equipment
HD Video Solution for Advanced Driver Assistance Systems (ADAS)
Seamless Connectivity Fuels Industrial Innovation
Heat Sinks for SiC, GaN or IGBT Power Modules
10 Gbps Full Bandwidth Digital Isolator
Global Survey Conducted by Molex Highlights Continued Progress in Industry 4.0
Standalone Image Signal Processor for 4K 30 Fps Video
Non-contact Switch for Hygienic Switching
10 Gbps Full Bandwidth Digital Isolator
Global Survey Conducted by Molex Highlights Continued Progress in Industry 4.0
Thin Air: How Power Entry Modules can Withstand Heights
Non-Contact Voltage Clamp Meter Ensuring Secure Electrical Measurements
1-phase High Current Choke
Medical Desktop Adapters in the 90W Power Supply Range
Schurter UMT-W 20A Fuse
JUMO Ex-i Isolating Switch Amplifier
JUMO NESOS R40 LSH Float Switches in Horizontal Version
IERA 2021 Awarded to ABB's PixelPaint Solution
High Reliability Output Modules Ideal for Industrial Applications
New Current Sensor Element and Firmware Upgrade for Award-winning Yokogawa Precision Power Analyzer 
PTC Leverages Spatial Computing Capabilities with Vuforia Engine Area Targets
Standard Self-Latching Multipole Connectors with Alignment Key
HMS Networks Releases the World’s First Industrial 5G Router and Starterkit
New Series of Transducers for High Performance Gaging Probes
LEMO Marks its 75th Anniversary in 2021
Ultrasonic Sensors with IO-Link Interface
Turning Data into Actionable Information is Vital to the Success of any Industry 4.0 Projects