Presto Engineering and Cadence Partner to Expand Semiconductor Package Design Solutions for Automotive and IoT Markets

  Enquiry / contact me

Presto exclusively takes on Cadence's system design and analysis portfolio for advanced IC packaging

Electronics & Electricity, Industry 4.0

Presto Engineering and Cadence Partner to Expand Semiconductor Package Design Solutions for Automotive and IoT Markets
Presto Engineering and Cadence Partner to Expand Semiconductor Package Design Solutions for Automotive and IoT Markets

Presto is adopting Cadence Allegro® X Package Designer Plus, Clarity™ 3D Solver, Sigrity™ XtractIM™ technology and Celsius™ Thermal Solver to design IC packaging solutions. Presto plans to provide Cadence with input on software features, functions and workflows specific to their end-customer and market needs.

We are pleased to collaborate with Cadence, a leader in electronic design software, system-level analysis, hardware and IP,” declared Cédric Mayor, vice president global strategy and corporate development at Presto. “Our ability to leverage the Cadence packaging design and analysis workflow will help us broaden our design services for IC packaging customers needing tailored capabilities and specific requirements. In our efforts to date, we have already seen a 50 percent faster turnaround time due to a reduction in design iterations enabled by Cadence technologies.

Collaboration expected to reduce design turnaround and speed time to market

Developing today’s complex semiconductor packages, such as heterogeneous SiPs with 3D chip stacks and high-speed data transfer packages, requires a high level of collaboration between IC designers and package engineers,” said KT Moore, vice president, product management in the Custom IC & PCB Group at Cadence. “With no two package designs being alike, collaborating with Presto allows us to capture insights on state-of-the-art package design trends as well as design team collaboration and workflow productivity.

SiP and 3D packages tend to require many rotations to optimize BOM and design tolerances to enable full control of chip performance reproducibility. With the addition of the Cadence portfolio, Presto offers a comprehensive set of design and qualification tools to help customers achieve the most efficient design for manufacturing (DFM) process, strengthening its position in microelectronics.

Posted on July 7, 2021 - (565 views)
Related articles
AI computing, Network Capabilities and Miniature Design in IPCs
Monitoring and Surveillance Solutions for Governmental Authorities
SMAR Off-axis Modular Encoder
YOKOGAWA’s Global virtual event Y NOW 2021
Wireless Systems that Simplify IoT Connectivity
Stratasys Innovation Showcased at Formnext With Largest-ever new Product Line-up
Streamlined Transmitter
Manufacturing Operations Management: A High-Value Starting Point for Digital Transformation
Yokogawa Invests in CyberneX, Developer of a Technology for 
Measuring Brainwaves with a High-performance Earphone-type Device
FDT 3.0 and OPC UA: Enabling IT/OT Interoperability in the New Age of Automation
YOKOGAWA’s Global virtual event Y NOW 2021
PROFINET Encoders for the Connected Factory
Displays for HMI Solutions
Ultra-rugged Computer-on-module for the Transportation Sector
Single Board Computer for Real-time Critical Applications
150W and 300W Open Frame Free Air Convection Cooled Power Supplies
Powerful System-On-Module With Expanded Feature Set
Kontron Completes its KBox B-202-CFL Industrial PC with Two New Variants
Non-contact Switch for Hygienic Switching
10 Gbps Full Bandwidth Digital Isolator
YOKOGAWA’s Global virtual event Y NOW 2021
Metal Enclosed AC/DC Power Supplies from 18 to 960 Watt
Distributive IIoT Architecture
Ultra-rugged Computer-on-module for the Transportation Sector
Managed Service Suite Platform for Plant Asset Performance
Lilly Life Science Studio Automated Laboratory Goes Further in the Search For New Drugs
IERA 2021 Awarded to ABB's PixelPaint Solution
High Reliability Output Modules Ideal for Industrial Applications
New Current Sensor Element and Firmware Upgrade for Award-winning Yokogawa Precision Power Analyzer 
PTC Leverages Spatial Computing Capabilities with Vuforia Engine Area Targets