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KetaSpire® KT-850 SCF 30 offers a solution for improved sealing and mechanical performance
"Smart Performance" variant for higher computing performance
Demand for custom lens designs that meet the exact needs of camera and sensor organizations targeting aerospace application is rising dramatically.
Valtrix STING enables reliable and easy-to-use dynamic testing
THP7312-P delivers high video streaming resolutions at higher frame rates
Kontron launches COMe-bEP7 Type 7 module with 4 SODIMM sockets delivering 128 GB DDR4 RAM
Flow-UV™ is a full-spectrum UV-Visible spectrophotometer particularly adapted to continuous flow applications but also to batch analysis
Optical Surfaces has supplied precisely matched Fabry-Perot etalon pairs to Table Stable Ltd designed for use as a key component in their JRS Series interferometers
Hexadrone has started serial production of its first modular tool-carrier drone
The technical partnership agreement will enhance Aston Martin’s team workload scheduling and management solution
Infineon Technologies AG improved the EasyDUAL™ CoolSiC™ MOSFET modules for high-power density applications
Enhanced scalability with low power and cost in new form factors enable UltraScale+ devices for numerous growth market opportunities ranging from IoT to networking
Up to 8 simultaneous channels & up to 10km range
Danfoss Editron provides another example of how the company is transforming the construction market by enabling the electrification of heavy-duty machinery
With FDM® ABS-CF10, Stratasys now makes carbon fiber much more accessible to the engineering and manufacturing community with high-performance F170™, F270™, and F370™ 3D printers.
Sfera Labs's Strato Pi & Iono Pi modules will have extended temperature range for better thermal management.
Freudenberg Sealing Technologies and its French Customer Definox developed high-performance, hygiene requirements compliant butterfly seals
Xilinx launched the new software-defined, hardware accelerated Alveo™ as a fully composable and easy to program 100Gb/s SmartNIC which provides line rate network function offloads
Elesa and Misati ally to launch high performance Misati pneumatic clamps for automation and robotics applications
Basler Boost brings on the market six new CXP Cameras with 20, 32, and 45 MP Resolution and sensors from ON Semiconductor's XGS series.
Morof to step down and Matthew Brown to be appointed Chief financial officer of Altair on March 16, 2021
Mosca replaces physical presence at the Interpackl trade faire with online-hosted virtual exhibition stand until 25 February 2021.
Contacted by IEN Europe, Neil Hannay, Senior Development Engineer at Titan Enterprises explains us what are the main challenges of metering fluid flow in Healthcare applications
An application story from Omron
An application story from Schurter
Coming with an infographic, this document highlights key differences and benefits of COMs
Gas turbines are an efficient means of power generation that can be quickly deployed during times of peak demand
The CC-Link Partner Association announced at 2020 SPS Connect that Analog Devices has become a CLPA Board Member to promote the acceptance of CC-Link IE TSN at the global level
Designed to enhance CPU performance, real-time behavior and graphics capabilities
Fast, robust, reliable: 5Gang stands for efficient and powerful networking in production using 5G and cloud technologies. Focal points are firstly flexible production and secondly automatic status detection and control of the "factory of tomorrow''
CAD models as holograms. Augmented Reality (AR) Engineering is a new approach to engineering that uses extended reality software and hardware to visualise, manipulate and create 3D CAD data in a real-world environment
The abbreviation VUCA – volatility, uncertainty, complexity, and ambiguity – has entered our daily life more than ever. The world is undergoing radical changes in many ways. How can companies cope with it? Agile manufacturing is part of the answer
This strategic collaboration will leverage Microsoft’s 3D time-of-flight (ToF) sensor technology
Provide compact analysis of incremental signals
For efficient inspection of bolted joints
NXP releases its new family of 2x2 Wi-Fi 6 6 (802.11ax) Dual Band + Bluetooth/BLE solutions, allowing new levels of connectivity for advanced gaming, audio, industrial and IoT market, powering first WiFI 6 enabled gaming consoles
Designed for AI applications at the Edge, image processing and transport/traffic
MakerBot introduced a new material which can retain its mechanical properties due to low moisture absorption
Thanks to this agreement, Mouser now stocks iWave’s SoMs based on Xilinx, NXP Semiconductors, and Intel® PSG technologies for industrial, automotive, medical, imaging, networking, and artificial intelligence (AI) applications
The new materials will bring strong mechanical and thermal properties to METHOD X 3D printer for a broad range of engineering applications
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