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The new ICE1 IO-Link masters from Pepperl+Fuchs support PROFINET S2 system redundancy, which enables two controllers to be connected to the module simultaneously
This strategic collaboration will leverage Microsoft’s 3D time-of-flight (ToF) sensor technology
With active shielding technology
Offer smooth and precise cursor control
The Internet Engineering Task Force (IETF) has chosen the SmartBlue CPace protocol from Endress+Hauser as a recommended internet standard for password-protected access to instruments
Emerson also joins the OPC Foundation Field Level Communications (FLC) initiative to drive a holistic approach to sensor and device level communications across process and factory automation industries
Thermowells have become well-established for measuring temperature in industrial applications worldwide, but with the emergence of digitally-enabled non-invasive temperature sensors there is an alternative
Predictive maintenance has been discussed for many years. Yet, something has just recently changed. The result is that predictive maintenance is converging with the IIoT and revenues are now growing exponentially
Pepperl+Fuchs presents WILSEN.sonic.level, its first LoRaWAN and autonomous IoT sensor that gives mobile containers the necessary intelligence to tell operators when and where they need to be collected
Equipped with built-in display
With interchangeable probes and smart transmitters
Designed for 3D scanning of shiny metal surfaces
Suitable for use in applications with mid and high-pressure ranges
Micro-Epsilon is investing more than 10 million Euros in a production centre for micro-mechatronics at its headquarters in Germany. In the future, sensors developed for the semiconductor and aerospace industry will be manufactured at the production centre
As its first Global IIoT Virtual Summit, Advantech stressed the importance of agile innovation as a key driver for the digital transformation in industrial applications
Compatible with EtherCAT, EtherNET/IP and Profinet
Symate and Pepperl+Fuchs partner to develop a new solution including specialist functions for automate process analysis and optimization
Nidec ASI is committed to creating an electric and green future, placing the Made-in-Italy excellence of its technologies at the heart of this revolution
The manual and complex THT (through hole technology) method is normally used to plug wired components on circuit boards. The software solution from ArtiMinds Robotics makes it possible to automate THT assembly
In this article, Analog Devices explains why Ethernet-APL will be a game-changer in the process automation world, creating new opportunities and business models thanks to rich datasets for cloud computing with powerful data analytics
New generation of significantly more sensitive sensor series
Laboratory Agnostic Device Standard (LADS) as new joint working group between SPECTARIS, OPC Foundation and VDMA
Allows mass deployment of battery-less sensors for ubiquitous IoT applications
It is undeniable that the Covid-19 crisis has accelerated some dynamics which were slowly taking hold in the industrial world. We have interviewed our readers through a survey to understand better how this all impacts the trade media landscape
Mesago Messe Frankfurt confirmed the cancellation of the ''physical event'' due to the complex sanitary situation. The virtual platform SPS Connect will go live on November 24
The H2020 project was financed with EUR 8.4 million. The objective is to develop an AI platform for the monitoring and analysis of mine sites across Europe using earth observation technologies to improve safety, environmental impact and profitability
Simple, configurable, and suitable for Industrial IoT environments
Nexa3D and Henkel partner for durable material for medical and athletic devices
On September 22 and 23, the SPE System Alliance hosts an international, digital exchange of knowledge between experts of different industries and technology sectors on the topic of Single Pair Ethernet
ABI Research forecasts the robot-related services powered by cloud computing will reach US$157.8 billion in annual revenue by 2030
Designed for LPWAN applications
Come with display, keys and IO-Link
This agreement will enhances Analog Devices' domain expertise and breadth of engineering capabilities to develop more complete solutions to solve customers’ most complex problems
Equipped with a highly sensitive crystal which guarantees extremely precise measuring results
Designed for temperature checking of people of all ages
International collaboration takes Vaisala and the Finnish Meteorological Institute (FMI) to Mars onboard NASA’s Mars 2020 Perseverance rover. The rover is scheduled to launch on July 30, 2020.
New enhancements including integration of Universal Robots
Pepperl+Fuchs’ 2020 Online Summit is a free digital platform that will allow customers and other interested parties to learn about the latest trends and solutions in factory and process automation—even during the COVID-19 pandemic
Save the Date: July 20 to 24, 2020
The new e-commerce capability for strain gage customers in the US gives access to a one-stop shop to purchase Micro-Measurements’ market-leading strain gage solutions online, as well a comprehensive suite of product technical information and videos
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